SRS-2: Reflow Simulator
Observe and measure the curving and warping of electronic parts and boards due to thermal stress, using actual reflow conditions.
FEATURES & BENEFITS
- Measure the warping of a part or board due to heat
- A laser on the underside measures the displacement in both X and Y-axis directions
- 19-point configuration and selectable temperature setting allow for the measurement of warping trends
- Dedicated software analyzes the displacement measurement data
- Optional video monitoring system enables you to observe and record the melting process of the solder
SPECIFICATIONS
| Size |
Main unit: 650 (W) x 400 (D) x 425 (H) mm |
| Sample size |
Max 70 mm x 70 mm |
| Measurement range |
Max 70 mm (Y-axis) 0~3 mm (height direction) |
| Table travel speed |
Max 40 mm/s |
| Table resolution |
Smallest 10 µm |
| Illuminant |
Semiconductor Laser 670 nm class 2 |
| Spot diameter |
Approx. 70 µm |
| Resolution |
Smallest 0.2 µm |
| Measurement mode |
Optional temperature - Continual, specified by time measurement |
| Analytical software |
2D/3D Measurement display. Enlargement & reduction waveform |
* Specifications subject to change without notice.
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